SMD2018貼片自恢復(fù)保險(xiǎn)絲
Performance Specification
|
Model
|
V max
(V dc)
|
Imax
(A)
|
I hold
@25°C
(A)
|
I trip
@25°C
(A)
|
Pd
Typ.
(W)
|
Maximum
Time To Trip
|
Resistance
|
|
Current
(A)
|
Time
(Sec)
|
R i min
(W)
|
R1max
(W)
|
|
SMD2018-030SF
|
60
|
10
|
0.30
|
0.60
|
0.9
|
1.5
|
3.00
|
0.500
|
2.300
|
|
SMD2018-050SF
|
60
|
10
|
0.55
|
1.20
|
1.0
|
2.5
|
3.00
|
0.200
|
1.000
|
|
SMD2018-075SF
|
60
|
10
|
0.75
|
1.50
|
1.1
|
8.0
|
0.30
|
0.110
|
0.630
|
|
SMD2018-100SF
|
15
|
35
|
1.10
|
2.20
|
1.1
|
8.0
|
0.40
|
0.060
|
0.360
|
|
SMD2018-100SF33V
|
33
|
35
|
1.10
|
2.20
|
1.1
|
8.0
|
0.40
|
0.060
|
0.360
|
|
SMD2018-150SF
|
15
|
35
|
1.50
|
3.00
|
1.1
|
8.0
|
0.80
|
0.050
|
0.170
|
|
SMD2018-200SF
|
10
|
35
|
2.00
|
4.00
|
1.1
|
8.0
|
2.40
|
0.030
|
0.100
|
V max = Maximum operating voltage device can withstand without damage at rated current (Imax).
I max = Maximum fault current device can withstand without damage at rated voltage (V max).
I hold = Hold Current. Maximum current device will not trip in 25°C still air.
I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air.
Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C.
R1max = Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
|
Test
|
|
|
|
Conditions
|
|
|
|
Resistance change
|
|
|
Passive aging
|
|
|
|
+85°C, 1000 hrs.
|
|
|
±5% typical
|
|
|
|
Humidity aging
|
|
|
|
+85°C, 85% R.H. , 168 hours
|
|
±5% typical
|
|
|
|
Thermal shock
|
|
|
|
+85°C to -40°C, 20 times
|
|
|
±33% typical
|
|
|
Resistance to solvent
|
|
|
|
MIL-STD-202,Method 215
|
|
|
No change
|
|
|
|
Vibration
|
|
|
|
MIL-STD-202,Method 201
|
|
|
No change
|
|
|
|
Ambient operating conditions : - 40 °C to +85 °C
|
|
Maximum surface temperature of the device in the tripped state is 125 °C
|
Thermal Derading Chart
Recommended Hold Current(A) at Ambient Temperature(°C)
|
Model
|
Ambient Operation Temperature
|
|
-40°C
|
-20°C
|
0°C
|
25°C
|
40°C
|
50°C
|
60°C
|
70°C
|
85°C
|
|
SMD2018-030SF
|
0.48
|
0.42
|
0.35
|
0.30
|
0.24
|
0.21
|
0.17
|
0.15
|
0.10
|
|
SMD2018-050SF
|
0.87
|
0.77
|
0.67
|
0.55
|
0.46
|
0.41
|
0.36
|
0.31
|
0.23
|
|
SMD2018-075SF
|
1.19
|
1.05
|
0.91
|
0.75
|
0.61
|
0.54
|
0.47
|
0.41
|
0.32
|
|
SMD2018-100SF
|
1.71
|
1.52
|
1.32
|
1.10
|
0.94
|
0.84
|
0.74
|
0.64
|
0.50
|
|
SMD2018-150SF
|
2.38
|
2.10
|
1.82
|
1.50
|
1.27
|
1.13
|
0.99
|
0.85
|
0.64
|
|
SMD2018-200SF
|
2.95
|
2.65
|
2.35
|
2.00
|
1.74
|
1.59
|
1.44
|
1.29
|
1.06
|
Thermal Derating Curve
Average Time-Current Curve
Soldering Parameters
|
Profile Feature
|
Pb-Free Assembly
|
|
Average Ramp-Up Rate(Ts max to T p)
|
3℃/second mac.
|
|
Preheat
-Temperature Min(Ts min)
-Temperature Max(Ts max)
-Time(Ts min to Ts max)
|
150℃
200℃
60~180 seconds
|
|
Time maintained above:
-Temperature(TL)
-Time(tL)
|
217℃
60~150 seconds
|
|
Peak Temperature(Tp)
|
260℃
|
|
Ramp-Down Rate
|
6℃/second max.
|
|
Time 25℃ to Peak Temperature
|
8 minutes max
|
|
Storage Condition
|
0℃~30℃,30%~60%RH
|
Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free
Recommended maximum paste thickness is 0.25mm
Devices can be cleaned using standard industry methods and solvents.
Note 1:All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Physical Dimensions(mm.)
|
Model
|
A
|
B
|
C
|
D
|
E
|
|
Min.
|
Max.
|
Min.
|
Max.
|
Min.
|
Max.
|
Min.
|
Min.
|
|
SMD2018-030SF
|
4.72
|
5.44
|
4.22
|
4.93
|
0.50
|
1.20
|
0.30
|
0.25
|
|
SMD2018-050SF
|
4.72
|
5.44
|
4.22
|
4.93
|
0.50
|
1.20
|
0.30
|
0.25
|
|
SMD2018-075SF
|
4.72
|
5.44
|
4.22
|
4.93
|
0.50
|
1.20
|
0.30
|
0.25
|
|
SMD2018-100SF
|
4.72
|
5.44
|
4.22
|
4.93
|
0.50
|
1.20
|
0.30
|
0.25
|
|
SMD2018-100SF33V
|
4.72
|
5.44
|
4.22
|
4.93
|
0.50
|
1.20
|
0.30
|
0.25
|
|
SMD2018-150SF
|
4.72
|
5.44
|
4.22
|
4.93
|
0.50
|
1.20
|
0.30
|
0.25
|
|
SMD2018-200SF
|
4.72
|
5.44
|
4.22
|
4.93
|
0.50
|
1.20
|
0.30
|
0.25
|
Termination Pad Characteristics
Terminal pad materials：Tin-plated Nickel-Copper
Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
Recommended Pad Layout (mm.)
|
Tape And Reel Specifications (mm)
|
Governing Specifications
|
EIA 481-1
|
|
W
|
|
12.0 ± 0.2
|
|
P0
|
|
4.0 ± 0.10
|
|
P1
|
|
8.0 ± 0.10
|
|
P2
|
|
2.0 ± 0.05
|
|
A0
|
|
4.40 ± 0.10
|
|
B0
|
|
5.50 ± 0.10
|
|
B1max.
|
|
8.20
|
|
D0
|
|
1.50 + 0.1, -0
|
|
F
|
|
5.5 ± 0.05
|
|
E1
|
|
1.75 ± 0.10
|
|
E2min.
|
|
10.25
|
|
T
|
|
0.6
|
|
T1max.
|
|
0.1
|
|
K0
|
|
1.36 ± 0.1
|
|
Leader min.
|
|
390
|
|
Trailer min.
|
|
160
|
|
Reel Dimensions
|
|
|
A max.
|
|
178
|
|
N min.
|
|
50
|
|
W1
|
|
12.4 ± 0.5
|
|
W2
|
|
18.4 ± 0.5
|
|
|
|
|
|
Storage And Handling
|
|
? Storage conditions：0℃~30℃, 30%~60% R.H.
|
|
? Devices may not meet specified performance
|
|
if storage conditions are exceeded.
|
|
|
Part Number System
SMD 2018 - 口口口 S F 口口V
special voltage Rating(Optional)
Lead-Free
Tin-plated Nickel-Copper
Holding Current Rating
Device Dimensions: Length/width(Unit:1/100 inch) Size 5045 mm / 2018 inch
Surface Mount Device
東莞市富寬源電子有限公司（東莞市富源電子科技有限公司）成立于1998年，主要從事安規(guī)元器件生產(chǎn)和銷售，通過10年的改革和努力現(xiàn)在的富寬源已經(jīng)成為集生產(chǎn)和銷售為一體的安規(guī)元器件總匯；富寬源將繼續(xù)秉持品質(zhì)第一、服務(wù)客戶的原則不斷為廣大客戶提供質(zhì)優(yōu)價(jià)廉的產(chǎn)品。我公司目前主要提供如下產(chǎn)品:
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微型電流保險(xiǎn)絲
高壓電流保險(xiǎn)絲
直流電流保險(xiǎn)絲
交流電流保險(xiǎn)絲
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AI-插件式自恢復(fù)保險(xiǎn)絲
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大電流|高壓保險(xiǎn)座
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壓敏電阻
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本公司將繼續(xù)通過ISO9000質(zhì)量管理體系的有效實(shí)施，使涉及企業(yè)生產(chǎn)經(jīng)營的各個(gè)運(yùn)作環(huán)節(jié)，均嚴(yán)謹(jǐn)有序，不斷制造出質(zhì)優(yōu)價(jià)廉、適銷對路的產(chǎn)品參與市場競爭，使企業(yè)長期保持較強(qiáng)的經(jīng)營獲利能力。同時(shí)我們將長期重視與行業(yè)知名企業(yè)合作，爭取最大限度的代理權(quán)，以最優(yōu)惠的價(jià)錢把產(chǎn)品銷售給客戶。
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